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Material: Fiberglass Board + Bakelite<br> Application: Suitable for power boards with tall components
Material: Titanium Alloy + Synthetic Stone<br> Product Introduction: It is mainly used for PCBA such as power boards with small cavity walls. It is applicable to the wave soldering and tin furnace process production where the SMT chip components on the back are relatively close to the DIP through-hole components, as well as the production of large-volume orders (without deformation).
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