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Papua New Guinea Reflow Soldering Jig + Cover Plate
Application: Suitable for power boards with tall components
Category:
Product Description
Manufacturing Principle:
Design based on the blank and assembled PCBs provided by the customer; mainly to protect DIP and SMD components during wave soldering and reflow soldering; ensure sufficient soldering on the components and avoid cold solder joints. Tall and large components will not float.
Features of Reflow Soldering Jigs:
1. Excellent performance at high temperatures and stable dimensions
2. First - class anti - static performance and long service life
3. Materials can be selected from synthetic stone, aluminum alloy, fiberglass board, and yellow bakelite
4. Suitable for PCBs used in reflow soldering and wave soldering
Materials to be Provided by the Customer:
1. Blank and assembled PCBs
2. GERBER data
3. Product manufacturing requirements (written materials)
4. Samples can be made first as required, followed by mass production
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